FUNCTION PARAMETER
*. Two independent heating zones, multitude temperature zones control, lead free process.
*. Top heating zone use to infrared
*. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
*. Six-section temperature controls, simulates re-flower effect completely.
*. cools PCB after heating, to prevent PCB deflection.
*. BGA welding on completion of the demolition, a voice prompt
*. Vacuum wand sucks BGA, convenient, reliable and durable
*. Card board with a special tooling for a wide variety of notebook motherboard(option )
*. COM connection, connect with computer to achieve hi-end rework function.
MODEL
|
RF7500
|
Solder Type
|
Normal Solder/Lead free
|
SMD
|
µBGAãÂÂÂÂBGAãÂÂÂÂCSPãÂÂÂÂQFP
|
Thickness
|
0.5-4mm
|
PCB Size
|
MAX 250mmW*200mmL
|
Heating/Consumption(Upper)
|
IR /250W
|
Heating/Consumption(Bottom)
|
IR/1200W
|
Control
|
COM connection,PC connected
|
Max Consumption
|
1.5KW
|
Power
|
220V OR 380V OR 110V
|
Dimension
|
300mmL X 330mmW X 360mmH
|
Weight
|
14Kg
|
Packet
|
Carton
|